Firmware Oppo F9 CPH1823 Fix Change Emmc Tested Files
ASC Support Files
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SPESIFIKASI
Network Technology
GSM / HSPA / LTE
Launch Announced 2018, August
Status Available. Released 2018, August
Body Dimensions 156.7 x 74 x 8 mm (6.17 x 2.91 x 0.31 in)
Weight 169 g (5.96 oz)
Build Glass front (Gorilla Glass 6), aluminum back, plastic frame
SIM Dual SIM (Nano-SIM, dual stand-by)
Display Type IPS LCD
Size 6.3 inches, 97.4 cm2 (~84.0% screen-to-body ratio)
Resolution 1080 x 2340 pixels, 19.5:9 ratio (~409 ppi density)
Protection Corning Gorilla Glass 6
Platform OS Android 8.1 (Oreo), upgradable to Android 10, ColorOS 7.0
Chipset Mediatek MT6771 Helio P60 (12 nm)
CPU Octa-core (4x2.0 GHz Cortex-A73 & 4x2.0 GHz Cortex-A53)
GPU Mali-G72 MP3
Memory Card slot microSDXC (dedicated slot)
Internal 64GB 4GB RAM, 64GB 6GB RAM, 128GB 6GB RAM
eMMC 5.1
GSM / HSPA / LTE
Launch Announced 2018, August
Status Available. Released 2018, August
Body Dimensions 156.7 x 74 x 8 mm (6.17 x 2.91 x 0.31 in)
Weight 169 g (5.96 oz)
Build Glass front (Gorilla Glass 6), aluminum back, plastic frame
SIM Dual SIM (Nano-SIM, dual stand-by)
Display Type IPS LCD
Size 6.3 inches, 97.4 cm2 (~84.0% screen-to-body ratio)
Resolution 1080 x 2340 pixels, 19.5:9 ratio (~409 ppi density)
Protection Corning Gorilla Glass 6
Platform OS Android 8.1 (Oreo), upgradable to Android 10, ColorOS 7.0
Chipset Mediatek MT6771 Helio P60 (12 nm)
CPU Octa-core (4x2.0 GHz Cortex-A73 & 4x2.0 GHz Cortex-A53)
GPU Mali-G72 MP3
Memory Card slot microSDXC (dedicated slot)
Internal 64GB 4GB RAM, 64GB 6GB RAM, 128GB 6GB RAM
eMMC 5.1
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